Dielectric Barrier Discharge Plasma Deoxidation of Copper Surfaces in an Ar/SiH4 Atmosphere

Abstract Nowadays, cold plasma techniques like dielectric barrier discharge (DBD) plasmas have attracted considerable interest in view of high deoxidation efficiencies as well relative simplicity setups. Although DBD copper has been mainly studied Ar/H 2 mixtures, there is no information on reduction performance such methods other protective atmospheres. In this study, the natively oxidized surfaces using a an Ar/SiH 4 atmosphere at 100 hPa and 20 °C was investigated. The influence silane gas by varying SiH concentration from 0.0 to 0.5 vol%. An addition Ar results increase effect plasma, so almost all Cu O reduced after 10 s treatment 0.1 vol% silane. Surface morphology analysis showed formation particles treatments that can be cleaned wiping. Additionally, characterization phase indicated presence * radicals likely play role effect. Moreover, elimination residual oxygen nitrogen species observed.